Low Temperature Curing Prepreg & SPRINT™ Materials
Gurit’s range of low temperature curing prepregs have been developed to allow for the use of cost-effective tooling solutions in the construction of large components.
Product Selector
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Format
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System
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Main Features
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Fastest Cure
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Recommended Processing Method
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Max Tg1
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Typical Applications
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Prepreg
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SE 70
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- Curable at 70°C in thick sections
- Available in SPRINT™ and prepreg formats
- Range of compatible 70°C curing products
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25 mins at 120°C
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- Autoclave
- Press Moulding
- Vacuum Bagging
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126°C
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Sandwich structures with honeycomb, foam and balsa cores
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SPRINT™
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ST 70
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SE 70
SE 70 is a family of hot melt, low temperature (70ºC) cure, epoxy prepreg systems. They have been developed for use in the construction of large components using low energy cure cycles, and have an outlife of 28 days at 21°C. Excellent properties can be achieved at this cure temperature, particularly compressive and interlaminar shear strengths.
ST 70
This is a low temperature (70ºC) cure, SPRINT™ system. Developed for use in the construction of large components using low energy cure cycles, it has an outlife of 21 days at 21°C. Excellent properties can be achieved at this cure temperature, particularly compressive and interlaminar shear strengths.
For further information, please see the related documents on the side bar or contact your customer support representative.